機器(委託対応)の詳細情報

Detailed Information of Equipment(Job Request)

Equipment and Job Request Information
Affiliation Faculty of Pure and Applied Sciences
Category LSI Packaging Equipment
Equipment (Job Request) Wafer Dicing Machine DAD322
Supplier (Equipment type) DISCO (DAD322)

Specification・Features

Device to quarry a tip of the desirable dimensional size from a wafer.
Workable substrate; Silicon, SiC, Sapphire, Quartz glass, Printed circuit board
Work size: Maximum 6 inches in diameter
Cutting range; 150 mm                                                                    
Cutting speed; 0.1-100 mm/s                                                                     Depth precision; 0.005 mm
Positioning precision; 0.005 mm                             
Installation site Cooperative Research Building C 309
Remark
Research Accomplishment
Inquiry 利用相談はこちらより必要事項をご記入の上、お問い合わせください。
機器担当者 担当者:微細加工PFスタッフ
University-wide
Shared Use Rate
600 Yen / 30 min.
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