機器(委託対応)の詳細情報

Detailed Information of Equipment(Job Request)

Equipment and Job Request Information
Affiliation Faculty of Pure and Applied Sciences (ARIM)
Category LSI Packaging Equipment
Equipment (Job Request) (ARIM)Packaging West Bond
Supplier (Equipment type) West BOND

Specification・Features

Bonder to a tip carrier or suabstrate
Bonding method; Supersonic wave / heat crimp wedge bonding
Bonding wedge; 45, 90 degrees
Wire class; Aluminum line, gold streak
Work holder temperature; More than 300 degrees Celsius
Sample size; less than 50mm square, DIP package
Installation site Cooperative Research Building C 301
Remark
Research Accomplishment
Inquiry 利用相談はこちらより必要事項をご記入の上、お問い合わせください。
機器担当者 担当者:ARIMスタッフ
所属:数理物質系 マテリアル先端リサーチインフラ事業(ARIM)
University-wide
Shared Use Rate
940 Yen / 30 min.
Picture