機器(委託対応)の詳細情報

Detailed Information of Equipment(Job Request)

Equipment and Job Request Information
Affiliation Faculty of Pure and Applied Sciences (ARIM)
Category LSI Packaging Equipment
Equipment (Job Request) (ARIM)Wafer Dicing Machine DAD322
Supplier (Equipment type) DISCO (DAD322)

Specification・Features

Device to quarry a tip of the desirable dimensional size from a wafer.
Workable substrate; Silicon, SiC, Sapphire, Quartz glass, Printed circuit board
Work size: Maximum 6 inches in diameter
Cutting range; 150 mm                                                                    
Cutting speed; 0.1-100 mm/s
Depth precision; 0.005 mm
Positioning precision; 0.005 mm
Installation site Cooperative Research Building C 309
Remark
Research Accomplishment
Inquiry 利用相談はこちらより必要事項をご記入の上、お問い合わせください。
機器担当者 担当者:ARIMスタッフ
所属:数理物質系 マテリアル先端リサーチインフラ事業(ARIM)
University-wide
Shared Use Rate
630 Yen / 30 min.
University-wide
Job Request Rate
4,800 Yen / hr.
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