機器(委託対応)の詳細情報

Detailed Information of Equipment(Job Request)

Equipment and Job Request Information
Affiliation Faculty of Pure and Applied Sciences
Category LSI Process Equipment
Equipment (Job Request) Dry Etching Equipment CDE-7-4(Power Electronics)
Supplier (Equipment type) SHIBAURA MECHATRONICS CORPORATION CDE-7-4

Specification・Features

[Features of the apparatus]
・ This equipment provides purely chemical dry etching applications free from plasma damage. It is possible to etch a variety of materials such as Si, SiO2 and SiN.

・ The plasma ignition point and wafer stage is isolated (complete remote plasma).

・ It corresponds a 6-inch wafer at the maximum, but can be a small sample of a few millimeters square also processing. A maximum of 25 wafers can be loaded in the sample chamber, and all can be processed automatically.

[Specification]
・ Plasma power supply : Microwave 2.45GHz, 1.0kW, Etching gas : CF4 ,O2 ,N2
・ Wafer size : A few millimeters ~ 6 inches

Date of acquisition : 25th Mach 2014
Installation site Laboratory of Advanced Research B0022
Remark
Research Accomplishment
Inquiry 利用相談はこちらより必要事項をご記入の上、お問い合わせください。
機器担当者 担当者:蓮沼
所属:数理物質系
University-wide
Shared Use Rate
1,800 Yen / 30 min.
University-wide
Job Request Rate
10,000 Yen / hr.
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